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ISSCC keynoter wants 100X power efficiency improvement
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Power efficiency is the single biggest challenge facing the mobile handset industry, and collaboration and co-design are needed to enable the industry to deliver a 100X improvement in power efficiency for mobile devices, according to a keynote presentation at the International Solid State Circuits Conference.
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Sapphicon partners AWR to develop Silicon-on-Sapphire process design kits
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Sapphicon Semiconductor, a designer and manufacturer of high performance integrated circuits based on silicon-on-sapphire (SoS) process technology, and AWR Corporation, a high-frequency EDA solutions provider, have introduced process design kits (PDKs) for AWR software that support Sapphicon's advanced SoS processes.
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Avago products added to Digi-Key European linecard
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Digi-Key Corp. has expanded its partnership with Avago Technologies US Inc. to supply its products in Europe.
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Metering chips feature isolated sensing technology
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Teridian Semiconductor has begun sampling its fourth generation residential smart metering integrated circuits (ICs) that eliminate costly current transformers and associated copper wiring in 2-element residential meters, with up to class 0.2-accuracy.
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When a solution is the solution, or: when an old dog meets an old dummy (load)
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The liquid dummy load is an intriguing solution, both literally and figuratively, to a common problem
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Power amplifier linearization SoC enables highly efficient broadband 3G and 4G networks
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Scintera Networkshas made available its SC1887 adaptive RF power amplifier linearizer (RFPAL) system-on-chip (SoC).
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Miniaturized comparators offer portable applications benefits
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STMicroelectronics has completed its portfolio of industry-standard comparators in space-saving packages with the introduction of the LMV331 packaged in a choice of 2.00 x 1.25 mm SC70 or 2.90 x 1.60 mm SOT23 form factors.
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Miniaturized comparators offer portable applications benefits
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STMicroelectronics has completed its portfolio of industry-standard comparators in space-saving packages with the introduction of the LMV331 packaged in a choice of 2.00 x 1.25 mm SC70 or 2.90 x 1.60 mm SOT23 form factors.
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Diodes unveils next generation low noise block controllers for DBS applications
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Diodes Incorporated has introduced a new family of low noise block (LNB) controllers for direct broadcast satellite (DBS) applications.
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Overvoltage-protection devices from -75V to +44V target automotive applications
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Maxim Integrated Products announced the MAX16914/MAX16915 overvoltage-protection controllers for automotive and industrial systems that must tolerate high-voltage transient and fault conditions
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