To support his update on the state and future of microelectromechanical systems (MEMS) for automotive and consumer applications, Jiri Marek, senior vice president of Bosch's sensors division (Germany) used his opening slot at ISSCC's Monday plenary session to describe the first integrated inertial sensor modules, combining yaw rate and acceleration sensor stacked on an ASIC in a molded SOIC16w package.

OmniVision Technologies, Inc. will show its second-generation CMOS imaging chip to OEMs during next week's Mobile World Congress.

Peratech Ltd. (Richmond, UK) has signed a licensing agreement for its Quantum Tunnelling Composite (QTC) technology, which will be included within a new range of pressure sensing components from Samsung Electro-mechanics (Seoul, Korea).

Laser Operations LLC, manufacturer of the QPC Lasers product line, announced new power and brightness records for lasers operating at eye-safe wavelengths between 1410 and 1550nm

Semtech launched the RClamp 2502L, a 2.5V device in SO-8 package that provides ESD, CDE and lightning protection

Renesas Technology Europe is to release the CRD5CM reverse conducting thyristor for use in voltage regulators for two-wheeled vehicles and engines for general-purpose batteries.

Backside illumination is fast gaining traction, and TowerJazz Ltd. (Migdal Haemek, Israel) and SOI wafer supplier Soitec SA (Bernin, France) have joined forces to seize the opportunity.

Schurter introduces the USFF 1206 fuses, designed with very fast acting characteristic for low current applications.

Avago Technologies launched a new series of high brightness blue and green 5mm through-hole LEDs for use in electronic sign and signal applications.

Ultracapacitor innovators, Ioxus Inc (Oneonta, New York, USA) has recently launched a new family of large cell prismatic electrochemical double layer capacitors (EDLC) for transportation and utility applications that have been developed to be more cost effective in terms of overall system designs.